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Measuring the Business Value of Green Datacenters

By : HP ProLiant G6 Servers Intel Published Date: Oct 19, 2009
Today, policy and business leaders are reaching a consensus that industry must address rising greenhouse gas (GHG) emissions. Leading enterprises are now turning to the practical challenge of determining how, how much, and at what cost to reduce emissions.
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HP ProLiant G6 Servers Intel

True Convergence Demands a Communication Service Provider that Embraces a Customer- Centric Approach

By : Sprint Published Date: Oct 16, 2009
Reaching tight alignment with these objectives is not an easy task. Yet, we believe when a communication services provider integrates these customer-centric objectives into the design of its converged solution, its business customers will no longer ask if the solution will meet their objectives. Rather, the question becomes one of execution: how and when to move to a converged communication solution. converged solution. From these attributes, a framework to measure and compare providers' converged solutions emerges. We will conclude with a review of Sprint's approach to offering true convergence to business and government customers.
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Sprint

Business Ready Configurations for Virtualization

By : Dell-Intel #2885 Published Date: Jul 16, 2009
The Business Ready Configurations for Dell PowerEdge blade servers, Dell EqualLogic SAN, and VMware Infrastructure provides a detailed reference architecture for deploying and using VMware virtualization on Dell blades and iSCSI storage environments. The Dell PowerEdge M1000e supports the recently announced 11th generation Dell PowerEdge M610 and M710 blade servers based on the new Intel Nehalem processors. The intended audience for this white paper is IT administrators, IT managers, and channel partners who are planning to deploy VMware virtualization using Dell blade servers and Dell EqualLogic SAN.
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Dell-Intel #2885

Comparison of VHDL, Verilog and SystemVerilog

By : Mentor Graphics Published Date: Sep 11, 2009
"As the number of enhancements to various Hardware Description Languages (HDLs) has increased over the past year, so too has the complexity of determining which language is best for a particular design. Many designers and organizations are contemplating whether they should switch from one HDL to another. This paper compares the technical characteristics of three, general-purpose HDLs.
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Mentor Graphics

ESC Boston 2009 Expo - largest community of designers, technologists, business leaders, and supplier

By : TechInsights Published Date: Sep 01, 2009
Join us at ESC Boston, September 21-24 at the Hynes Convention Center, in Boston, MA. Expo registration is FREE, and advanced registration pricing is still available for conference packages.
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TechInsights

Demystifying DO-254

By : Mentor Graphics Published Date: Aug 20, 2009
Interest in DO-254 first occurred in Europe and has since spread to the US commercial aircraft industry. If you are being asked about your company's DO-254 direction and compliance, but have been overwhelmed with information on the subject, then this article is for you.
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Mentor Graphics

Establishing Confidence in PDN Simulation

By : Mentor Graphics Published Date: Apr 03, 2009
A powerful signal integrity analysis tool must be flexibility, easy to use and integrated into an existing EDA framework and design flow. In addition, it is important for the tool to be accurate enough. This report reviews a validation study for the Mentor Graphics HyperLynx 8.0 PI tool to establish confidence in using it for power integrity analysis.
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Mentor Graphics

Measuring the Performance of Equalized Serial Data Links Across the Design Flow

By : Mentor Graphics Published Date: Apr 03, 2009
For advanced signaling over high-loss channels, designs today are using equalization and several new measurement methods to evaluate the performance of the link. Both simulation and measurement tools support equalization and the new measurement methods, but correlation of results throughout the design flow is unclear. In this paper a high performance equalizing serial data link is measured and the performance is compared to that predicted by simulation. Then, the differences between simulation and measurements are discussed as well as methods to correlate the two.
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Mentor Graphics

Power Integrity Effects of High Density Interconnect (HDI)

By : Mentor Graphics Published Date: Apr 03, 2009
High Density Interconnect (HDI) is being used more often to meet the growing need for more complex designs in smaller form factors. Beyond some of the more obvious electrical effects of using smaller vias, there is also an impact to the power integrity of a board using HDI. This includes different effects of mounted inductances of decoupling capacitors, changes in plane performance due to reduction in perforation from chip pinouts, and the inherent plane-capacitance changes from using dielectrics of various thicknesses. This paper will examine and quantify these effects, using numerous design examples, including a large conventional through-hole design board that was reduced using HDI.
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Mentor Graphics

Inflexion Platform UI: A New Approach to User Interface Creation for Consumer Electronic Devices

By : Mentor Graphics Published Date: Apr 03, 2009
The success of any consumer electronic device depends to a large extent on the appeal of the user interface (UI) and how easy the device is to use. Studies show that good cosmetic design can encourage users to explore the full range of features and often engenders the perception that a product is easier to use. So if the benefits of a great looking, easy-to-use UI are so clear, why are so many products still falling short of customer expectations? The solution lies in taking a fresh new approach a consumer electronic device UI plays. By identifying common UI functionality and implementing it in a reusable and customizable way, we can make it far easier for embedded engineers to deliver visually engaging and easy-to-use consumer electronic products.
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Mentor Graphics

Using C++ Efficiently In Embedded Applications

By : Mentor Graphics Published Date: Apr 03, 2009
Moving to C++ presents opportunities for higher programmer productivity. The requirements of embedded systems, however, demand that the adoption of C++ be carefully measured for the performance impact of run-time costs present in C++, but not in C. This talk suggests strategies for developers who are starting their acquaintance with C++.
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Mentor Graphics

The Multi-tiered Hybrid Data Center

By : HP Data Center Published Date: Mar 25, 2009
To accommodate increasingly dense technology environments, increasingly critical business applications, and increasingly stringent service level demands, data centers are typically engineered to deliver the highest-affordable availability levels facility-wide. Within this monolithic design approach, the same levels of mechanical, electrical, and IT infrastructure are installed to support systems and applications regardless of their criticality or business risk if unplanned downtime occurs. Typically, high redundancy designs are deployed in order to provide for all eventualities. The result, in many instances, is to unnecessarily drive up both upfront construction or retro-fitting costs and ongoing operating expenses.
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HP Data Center

Optimizing Uninterruptible Power for Modern Data Processing

By : TDI Transistor Devices Published Date: Feb 06, 2009
Uninterruptible Power Solutions are often solved at the facility level with unnecessarily large, inefficient, expensive and complex AC UPS systems. While this provides an easy demarcation line between the facility and end equipment, with each focusing on a different part of the problem, it also results in overall operating efficiency and total cost of ownership being difficult to ascertain and optimize.
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TDI Transistor Devices

Electronic Power Systems Tradeoffs Between Single Phase and Three-Phase Power

By : TDI Transistor Devices Published Date: Feb 06, 2009
Modern Electronic Systems are quite often powered from a three-phase power source. While utilizing power modules that operate directly from three-phase power might seem to provide optimal simplicity and flexibility, the added complexity required to realize three-phase power factor corrected circuitry usually negates any potential savings.
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TDI Transistor Devices

ModelSim Datasheet

By : Mentor Graphics Published Date: Aug 20, 2009
"ModelSim ASIC and FPGA design Mentor Graphics was the first to combine single kernel simulator (SKS) technology with a unified debug environment for Verilog, VHDL, and SystemC.
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Mentor Graphics

DxDesigner-PADS: The Most Powerful Electronics Design Environment for your Desktop!

By : Mentor Graphics Published Date: Aug 20, 2009
PADS DxDesigner A sophisticated yet scalable design environment fully intergrated with PADS
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Mentor Graphics

3D Viewing in PADS Web Seminar

By : Mentor Graphics Published Date: Aug 20, 2009
Interaction between electrical and mechanical engineering is more important than ever to achieve “first time” success for your design.
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Mentor Graphics

Automotive System Design and Mechatronics

By : IBM-America Published Date: Mar 24, 2009
Electronics and Software Engineering are quickly merging with traditional Mechanical Engineering to create a new paradigm in auto manufacturing: Mechatronics. Industry experts predict that this shift will bring about profound advances in automotive product development. Unfortunately, existing IT and process infrastructures do not provide sufficient capabilities to support the new paradigm: multiple data silos, a lack of standardized processes, and integration issues on a tool level (Mechanical, Electronic, Software) continue to pose serious obstacles to development efficiency, and remain a frequent source of delays, quality issues and cost increases.
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IBM-America

Power Supplies Goes Digital

By : Ericsson Published Date: Feb 06, 2009
Using digital control in power supplies is considerably more flexible than analog control in its ability to adapt to changes and digital control inside the power supply results in advantages to the system application such as improved efficiency, fewer external components and reduced overall cost.
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Ericsson

DC/DC Converters for Medical Applications

By : Recom Published Date: Feb 06, 2009
“Medical grade DC/DC converters” is an often used, but more often abused, description of a class of converters that are increasingly in demand. What are actually the particular requirements that medical applications place on DC/DC converters?
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Recom

IPV42/70 Series - Intelligent Power Distribution Units

By : Eaton Published Date: Feb 06, 2009
Power distribution units (PDUs) are vital to the management of power to IT arrays and have evolved from a simple panel of switches and outlets to designs that can now be considered "intelligent" through the inclusion of internal processing capabilities.
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Eaton

Using Digital Control to Improve Light Load Behavior

By : ROAL Living Energy Published Date: Feb 06, 2009
Since the very first Digital Power Forum which took place in 2004, many articles have been written touting the general advantages of using digital control.  It was at this time that ROAL Electronics introduced into the marketplace the first digitally controlled DC-DC converter.
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ROAL Living Energy

Why LabVIEW for Multicore Programming

By : National Instruments Published Date: Feb 06, 2009
National Instruments LabVIEW is a dataflow programming language, developers can write inherently parallel applications that can map to parallel hardware such as multicore processors and FPGAs for optimal performance. This white paper discusses dataflow programming and why NI LabVIEW is ideal for programming multicore systems.
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National Instruments

Three Levels of Data-Logging Software from National Instruments

By : National Instruments Published Date: Feb 06, 2009
This article introduces the three levels of data-logging software for use with National Instruments DAQ devices – NI LabVIEW SignalExpress, NI LabVIEW SignalExpress LE and NI LabVIEW.
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National Instruments
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Analog Communications, Digital Signal Processing, Electronic Design Automation, System On A Chip, Electronic Test and Measurement, Embedded Design, Boards & Modules, Embedded Systems and Networking, Electromechanical & Mechanical, Optoelectonics & Displays, Packaging and Interconnects, Passive & Discrete Components, Power Sources & Conditioning Devices, Integrated Circuits and Semiconductors, Sensors & Actuators
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